10AX115H3F34I2LG vs 10AX115H2F34I2LG Comparación
Comparación detallada lado a lado de 10AX115H3F34I2LG por Intel y 10AX115H2F34I2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115H3F34I2LG | 10AX115H2F34I2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6.800,00 | $4.995,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LEs) | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits | — |
| User I/O Count | 504 | — |
| Transceiver Count | 24 | — |
| Maximum Transceiver Data Rate | 17.4 Gbps | — |
| DSP Blocks | Variable-precision, floating-point capable | Hard floating-point DSP |
| DSP Performance | Up to 1.5 TFLOP/s (FP) | — |
| Hardened Memory Controllers | DDR4/DDR3/LPDDR3 | — |
| Hardened PCIe | PCIe Gen3 x8 | — |
| Hardened Ethernet MAC | 10G/40G/100G capable | — |
| Core Voltage | 0.9 V | 0.9 V (nominal) |
| Process Node | 20 nm | — |
| Encapsulado | 1152-ball FCBGA | 1152-ball FCBGA (BBGA) |
| Speed Grade | H3 | -2 |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial (-40C to +100C) |
| Estado RoHS | Compliant | Compliant (per distributor listing) |
| Logic Elements (LE) | — | 1,150,000 |
| Embedded Memory Bits | — | 68,857,560 |
| Maximum User I/O | — | 504 |
| Transceivers | — | 24 channels, up to 14.4 Gbps |
| Process Technology | — | 20 nm TSMC |
| Memory Controller | — | Hardened external memory interface (DDR4/QDR-IV) |
| PCIe Hard IP | — | PCI Express Gen3 x8 |
| Configuration | — | FPGA (SRAM-based, volatile) |
| Tipo de montaje | — | Surface Mount (BGA) |