10AX115N2F40I1SG vs 10AX115N2F40E1SG Comparación
Comparación detallada lado a lado de 10AX115N2F40I1SG por Intel y 10AX115N2F40E1SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115N2F40I1SG | 10AX115N2F40E1SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.720,00 | $3.325,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,856 bits | 68,857,600 |
| M20K Memory Blocks | [DATA_NEEDED: M20K count] | — |
| DSP Blocks | 3,036 | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 24 channels at up to 17.4 Gbps | — |
| Hard PCIe Gen3 Controllers | Yes, up to Gen3 x8 | — |
| Hard 10 Gbps Ethernet MACs | Yes (10GBASE-R/KR) | — |
| Hard Memory Controllers | 2 (DDR4, DDR3, QDR IV, RLDRAM 3) | — |
| Fractional PLLs | 6 | — |
| Process Technology | 20 nm TSMC | 20 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Transceiver Supply Rails | 0.95 V and 1.03 V | — |
| Encapsulado | 1517-ball FC-FBGA, 1.0 mm pitch | 1517-BBGA, FCBGA (F40) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial | — |
| Bitstream Encryption | Yes (AES-256) | — |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Blocks (M20K) | — | [DATA_NEEDED: M20K count] |
| Maximum User I/O Pins | — | 600 |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (chip-to-chip) |
| Hard PCIe IP Blocks | — | PCIe Gen3 |
| Package Dimensions | — | 40 mm x 40 mm |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | N2 |
| Temperature Grade | — | E1 (commercial) |
| Temperatura de unión de funcionamiento | — | -40C to +100C |