10AX115N2F45E2SG vs 10AX115N2F40I2SG Comparación
Comparación detallada lado a lado de 10AX115N2F45E2SG por Intel y 10AX115N2F40I2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115N2F45E2SG | 10AX115N2F40I2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.570,00 | $3.750,00 |
| Series | Arria 10 GX | — |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,856 |
| Embedded Memory Type | M20K SRAM blocks | — |
| DSP Blocks (18x19 Multipliers) | 1,518 | — |
| Maximum User I/Os | 768 | — |
| Transceiver Count | [DATA_NEEDED: transceiver count for -2 speed grade] | [DATA_NEEDED: transceiver count exact value] |
| Maximum Transceiver Data Rate | 17.4 Gbps | — |
| Hard Processor Subsystem | Dual-core ARM Cortex-A9 (optional HPS configuration) | — |
| PCI Express Hard IP | Gen3 x8 (hardened) | — |
| Process Technology | Intel 20nm Tri-Gate (FinFET) | TSMC 20 nm |
| Encapsulado | 1932-ball FCBGA, 45mm body (F45) | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount (flip-chip BGA) |
| Temperatura de unión de funcionamiento | 0C to +100C (commercial grade) | — |
| Speed Grade | 2 | 2 |
| Estado RoHS | Compliant | Compliant |
| Configuration Memory | Internal, supports serial and parallel configuration | — |
| Family | — | Arria 10 GX |
| Adaptive Logic Modules (ALMs) | — | 427,200 |
| Registers | — | 1,708,800 |
| User I/O | — | 600 |
| Transceiver Protocol | — | GX (up to 14.1 Gbps) |
| DSP Blocks | — | Variable-precision, hard floating-point |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |