10AX115R2F40I2SG vs 10AX115R2F40E1SG Comparación
Comparación detallada lado a lado de 10AX115R2F40I2SG por Intel y 10AX115R2F40E1SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115R2F40I2SG | 10AX115R2F40E1SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7.189,20 | $6.875,00 |
| Series | Arria 10 GX | Arria 10 GX |
| Family | Arria 10 | Arria 10 |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Logic Array Blocks (LABs) | 35,650 | — |
| Total Embedded Memory | 68,857,856 bits (approx. 8.2 MB) | — |
| Maximum User I/O | 342 | — |
| DSP Blocks | 1,518 variable-precision | 1,518 (variable-precision 20x19) |
| Transceivers | 24 channels, up to 17.4 Gbps | GX transceivers up to 14.2 Gbps |
| Hard Memory Controller | Yes (DDR3/DDR4/LPDDR3/RLDRAM3) | — |
| Hard PCIe Gen3 IP | Yes, x8 endpoint/root port | — |
| Temperature Grade | Industrial (-40C to +100C Tj) | Extended (-E1) |
| Process Node | TSMC 20 nm | — |
| Encapsulado | 1517-ball FCBGA (F40), 40 mm x 40 mm, 0.8 mm pitch | 1517-ball FCBGA (F40) 40x40 mm |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Estado RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 68,857,856 |
| Number of I/O | — | 342 |
| Hard Memory Controllers | — | Yes (DDR4, DDR3, LPDDR3, QDR IV) |
| Hard PCIe Block | — | PCIe Gen3 x8 |
| Process Technology | — | 20 nm TSMC tri-gate (FinFET) |
| Speed Grade | — | -2 |
| Lead Free | — | Yes |
| Configuration | — | SRAM-based, supports partial reconfiguration |