10AX115R3F40E2SG vs 10AX115R2F40E2SG Comparación
Comparación detallada lado a lado de 10AX115R3F40E2SG por Intel y 10AX115R2F40E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115R3F40E2SG | 10AX115R2F40E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.925,00 | $5.410,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | 427,200 |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | — |
| M20K Memory Blocks | 2,738 | 2,128 |
| DSP Blocks | 1,518 (variable-precision, hard FP) | — |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | Yes |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | 20 nm TSMC |
| Speed Grade | -2 | -2 (E2, mid) |
| Temperature Grade | E2 (0C to +100C) | — |
| Encapsulado | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-ball FCBGA, 40 x 40 mm |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount (flip-chip BGA) |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Estado RoHS | Compliant | — |
| Embedded Memory Bits | — | 68,857,856 |
| MLAB Memory Bits | — | 8,812,800 |
| Variable-Precision DSP Blocks | — | 1,518 |
| 18 x 19 Multipliers | — | 3,036 |
| PLLs | — | 16 |
| User I/O Pins | — | 342 |
| Transceiver Count | — | 48 (max 96 for the family) |
| Transceiver Data Rate | — | up to 17.4 Gbps (chip-to-chip) |
| PCIe Hard IP | — | Gen3 x1/x2/x4/x8 |
| Temperatura de funcionamiento | — | 0C to +100C (commercial) |
| RoHS | — | Compliant |