10AX115S1F45E1SG vs 10AX115S2F45E2SG Comparación
Comparación detallada lado a lado de 10AX115S1F45E1SG por Intel y 10AX115S2F45E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115S1F45E1SG | 10AX115S2F45E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5.850,00 | $6.975,76 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LEs) | 1,150,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 68,857,856 bits (approximately 53 Mbits) | — |
| Embedded Memory Blocks | M20K blocks | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/O Pins | 624 | — |
| Transceivers | Up to 12.5 Gbps (GX) | — |
| Hard IP | PCIe Gen3, DDR4 memory controllers | — |
| Process Technology | 20 nm TSMC | 20 nm TSMC |
| Core Voltage | 0.9 V (with on-chip regulation) | — |
| Encapsulado | 1932-BBGA, FCBGA (F45) 45 mm | 1932-ball FC-FBGA (F45) |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | -1 (slower) | 2 (mid) |
| Temperatura de funcionamiento | -40C to +100C (industrial) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory Bits | — | 68,857,856 |
| Embedded 18x19 Multipliers | — | 1,518 |
| Maximum User I/O Pins | — | 624 |
| Transceiver Count | — | 24 channels |
| Maximum Transceiver Data Rate | — | 28.05 Gbps |
| Core Voltage (Vcc) | — | 0.9 V (nominal) |
| Hard PCIe Gen3 Blocks | — | 2 |
| Fractional PLLs | — | 4 |
| I/O PLLs | — | 8 |
| Operating Temperature Grade | — | E2 (0C to +100C) |