10AX115S2F45E2SG vs 10AX115S3F45E2LG Comparación
Comparación detallada lado a lado de 10AX115S2F45E2SG por Intel y 10AX115S3F45E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115S2F45E2SG | 10AX115S3F45E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6.975,76 | $7.950,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory Bits | 68,857,856 | — |
| Embedded 18x19 Multipliers | 1,518 | — |
| Maximum User I/O Pins | 624 | — |
| Transceiver Count | 24 channels | — |
| Maximum Transceiver Data Rate | 28.05 Gbps | — |
| Process Technology | 20 nm TSMC | 20 nm |
| Core Voltage (Vcc) | 0.9 V (nominal) | — |
| Hard PCIe Gen3 Blocks | 2 | — |
| Fractional PLLs | 4 | — |
| I/O PLLs | 8 | — |
| Encapsulado | 1932-ball FC-FBGA (F45) | 1932-BBGA, FCBGA |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | E2 (0C to +100C) | — |
| Estado RoHS | Compliant | — |
| Speed Grade | 2 (mid) | -2 (Extended) |
| Logic Elements | — | 1,150,000 |
| Embedded Memory | — | 68,857,856 bits |
| User I/O | — | 624 |
| Core Voltage | — | 0.9 V |
| Footprint | — | F45 |
| Temperature Grade | — | Extended |
| Transceivers | — | Up to 28.05 Gbps backplane-capable |
| DSP Blocks | — | Hardened floating-point DSP |
| PCIe Hard IP | — | PCIe Gen3 x8 hard IP |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant) |