10AX115U4F45I3LG vs 10AX115U4F45E3LG Comparación
Comparación detallada lado a lado de 10AX115U4F45I3LG por Intel y 10AX115U4F45E3LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115U4F45I3LG | 10AX115U4F45E3LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5.920,00 | $5.650,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 68,857,856 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M20K count] | — |
| Embedded 18x18 Multipliers | 3,036 | — |
| Variable-Precision DSP Blocks | 1,518 | — |
| Maximum User I/O | 480 | — |
| Maximum Transceivers | 96 | — |
| Transceiver Data Rate | Up to 14.4 Gbps | — |
| PLLs | 24 | — |
| Process Technology | TSMC 20 nm | — |
| Core Voltage (Vcc) | 0.9 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Encapsulado | 1932-ball FCBGA (F45), 45 x 45 mm, 1.0 mm pitch | 1932-ball FCBGA |
| Estado RoHS | Compliant | Compliant |
| Logic Elements | — | 1,150,000 |
| Embedded Memory Bits | — | 68,857,856 |
| User I/Os | — | 480 |
| Process Node | — | 20 nm TSMC |
| Transceiver Channels | — | Up to 96 |
| Max Transceiver Data Rate | — | 17.4 Gbps |
| DSP Blocks | — | 1,518 (variable-precision) |
| Hard PCIe Gen3 Cores | — | Yes (x8 capable) |
| Hard Memory Controllers | — | Yes (DDR3/DDR4, QDR IV, RLDRAM 3) |
| Speed Grade | — | E3 (fastest commercial) |
| Temperature Grade | — | L (extended commercial) |
| Tipo de montaje | — | Surface Mount (BGA) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |