10CL010YE144A7G vs 10CL025YE144A7G Comparación
Comparación detallada lado a lado de 10CL010YE144A7G por Intel y 10CL025YE144A7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
10CL025YE144A7G - Cyclone 10 LP FPGA 25K LE, 76 I/O, EQFP-144 | Intel
10CL025YE144A7G ✓ ActivoComparación de especificaciones
| Parámetro | 10CL010YE144A7G | 10CL025YE144A7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $19,40 | $6,30 |
| Series | Cyclone 10 LP | — |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements (LE) | 10,320 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K blocks) | 414 kbit total (423,936 bits) | — |
| Number of Logic Elements | 10,320 | — |
| Number of I/Os | 88 | — |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Tensión de alimentación de funcionamiento | 1.2 V | — |
| Encapsulado / Carcasa | EQFP-144 (144-LQFP Exposed Pad) | — |
| Estilo de montaje | SMD/SMT | — |
| Temperatura de funcionamiento | -40 C to +125 C | — |
| Packaging | Tray | Tray |
| Number of Logic Cells | 10,320 | — |
| Process Node | 60 nm (low-power CMOS) | — |
| Configuration Interface | JTAG (IEEE 1149.1), serial | — |
| Design Tool | Intel Quartus Prime | — |
| RoHS | Compliant | — |
| Logic Elements | — | 24,624 LE |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 594 kbit (M9K blocks) |
| Embedded 18x18 Multipliers | — | 66 |
| General-Purpose PLLs | — | 4 |
| User I/O Count | — | 76 |
| Encapsulado | — | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| Rango de temperatura de funcionamiento | — | 0 C to 85 C (commercial, A7 suffix) |
| Speed Grade | — | -7 |
| Process Technology | — | Low-power 60 nm |
| Configuration Memory | — | On-chip flash (instant-on, no external boot PROM) |
| Tipo de montaje | — | Surface Mount |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Estado RoHS | — | Compliant |