10CL010YM164I7G vs 10CL016YM164I7G Comparación
Comparación detallada lado a lado de 10CL010YM164I7G por Intel y 10CL016YM164I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10CL010YM164I7G | 10CL016YM164I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,45 | $12,95 |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 10,320 | 15,408 |
| Embedded Memory | 423,936 bits (414 Kb) | 516,096 bits (56 M9K blocks of 9 Kbits) |
| Embedded 18 x 18 Multipliers | 23 | — |
| Maximum User I/O Pins | 101 | — |
| General-Purpose PLLs | 2 | 4 |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) | — |
| Rango de temperatura de funcionamiento | -40 °C to 100 °C (Industrial) | -40C to +100C (industrial) |
| Encapsulado | 164-ball MBGA (8 mm x 8 mm) | 164-ball MBGA (8x8 mm, 0.5 mm pitch) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| I/O Signaling Standards | LVCMOS 1.2 V to 3.3 V, LVDS | — |
| Process Node | TSMC low-power process | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020, typical for BGA) | 3 (per JEDEC J-STD-020) |
| Adaptive Logic Modules (ALMs) | — | 9,630 |
| Embedded 18x18 Multipliers | — | 56 |
| User I/O Pins | — | 87 |
| Process Technology | — | 60 nm low-power CMOS |
| Supply Voltage (Core) | — | 1.0 V to 1.2 V (internal) |
| I/O Bank Count | — | 8 |
| Static Power (Typical) | — | [DATA_NEEDED: typical static power mW at VCCINT=1.2V] |
| Bitstream Encryption | — | AES-256 supported |