10CL025YE144C6G vs 10CL025YE144I7G Comparación
Comparación detallada lado a lado de 10CL025YE144C6G por Intel y 10CL025YE144I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10CL025YE144C6G | 10CL025YE144I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,89 | $35,80 |
| Series | Cyclone 10 LP | Cyclone® 10 LP |
| Family | Cyclone 10 LP Field Programmable Gate Array | Cyclone 10 LP FPGA |
| Logic Elements (LEs) | 24,624 | — |
| Embedded Memory (bits) | 608,256 | — |
| Memory Blocks | M9K blocks, 76 total | — |
| 18x18 Hardware Multipliers | 156 | — |
| User I/O Count | 76 | — |
| Logic Array Blocks (LABs) | 1,539 | — |
| PLLs | 4 | 4 |
| Global Clocks | 20 | — |
| Core Voltage | 1.0 V (typical) | — |
| Process Node | 60 nm low-power CMOS | — |
| Speed Grade | 6 (fastest commercial) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +100C (industrial, I7 grade) |
| Encapsulado | 144-LQFP Exposed Pad (EQFP-144), 22x22 mm | 144-EQFP (EQFP-144) with exposed thermal pad |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Compliant | — |
| Configuration Scheme | SRAM-based, via JTAG / Active Serial / Active Parallel | — |
| Logic Elements (LE) | — | 24,624 (25K) |
| Embedded Memory | — | 594 Kbits (M9K blocks) |
| Embedded Multipliers | — | 66 (18x18 DSP blocks) |
| Maximum User I/O | — | 246 (family max); 76 in this 144-EQFP |
| User I/O Pins (this package) | — | 76 |
| Supply Voltage - Core | — | 1.2 V |
| Supply Voltage - I/O | — | 1.2 V to 3.3 V |
| Process Technology | — | 60 nm TSMC low-power |
| Estado RoHS | — | Compliant (lead-free, 'Y' suffix) |
| Configuration Mode | — | SRAM, JTAG/AS/PS support |
| Thermal Resistance (theta_JA) | — | 31 C/W (with soldered exposed pad) |