10CX105YF672I5G vs 10CX085YF672I6G Comparación
Comparación detallada lado a lado de 10CX105YF672I5G por Intel y 10CX085YF672I6G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10CX105YF672I5G | 10CX085YF672I6G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $108,00 | $255,00 |
| Family | Cyclone 10 GX | — |
| Logic Elements (LE) | 104,000 | 85,000 |
| Embedded Memory (bits) | 8,641,536 | — |
| Adaptive Logic Modules (ALM) | 39,240 (estimated from 104K LE) | — |
| 18x19 Multipliers | 156 | — |
| User I/O Banks | [DATA_NEEDED: User I/O Banks] | — |
| Maximum User I/O | 236 | 216 |
| Transceivers | Up to 12 (PCIe Gen2 capable) | — |
| Maximum Transceiver Data Rate | 12.5 Gbps | — |
| Hard PCI Express Blocks | 1 (Gen2 x1/x2/x4) | — |
| Hard Memory Controllers | DDR3, DDR4, LPDDR3 | — |
| Process Technology | 20 nm | — |
| Encapsulado | 672-ball FCBGA (F672) | 672-FBGA (F672) |
| Package Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant | Compliant |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Supply Voltage (I/O) | 1.2 V to 3.0 V (multi-voltage I/O) | — |
| Series | — | Cyclone 10 GX |
| Embedded Memory Bits | — | 5,959,680 |
| Process Node | — | 20 nm |
| Transceiver Data Rate | — | Up to 12.5 Gbps |
| Hard Memory Controller | — | DDR3 / DDR4 / LPDDR3 |
| DSP Blocks (18x19 Multipliers) | — | 156 |
| Operating Temperature Grade | — | Industrial |
| Core Voltage | — | 0.9 V (typical) |
| Hard PCIe Gen2 Endpoint | — | Yes |
| Speed Grade | — | -6 |