10M04DAU324I7G vs 10M08DAU324I7G Comparación
Comparación detallada lado a lado de 10M04DAU324I7G por Intel y 10M08DAU324I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M04DAU324I7G | 10M08DAU324I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $13,50 | $22,10 |
| Family | MAX 10 | — |
| Logic Elements | 4,000 | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K count] | 378 Kbits |
| User Flash Memory | 193,536 bits | 387,072 bits |
| User I/O Count | 246 | — |
| Process Technology | 55 nm TSMC | TSMC 55 nm embedded flash |
| Core Voltage | 1.2 V | — |
| Encapsulado | 324-pin UFBGA (U324) | 324-LFBGA (UBGA), 1.0 mm pitch |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Configuration Memory | Embedded flash (dual image) | — |
| On-die ADC | 12-bit, 8-channel (MAX 10 feature) | — |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| Global Clocks | [DATA_NEEDED: clock count] | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Nivel de sensibilidad a la humedad (MSL) | [DATA_NEEDED: MSL level] | — |
| Series | — | MAX 10 |
| Logic Elements (LE) | — | 8,000 |
| Maximum User I/O | — | 246 |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Supply Voltage (I/O Banks) | — | 1.2 V to 3.3 V |
| DSP Blocks (18x18 Multipliers) | — | 24 |
| On-chip ADC | — | Dual 12-bit, 1 MSPS |
| Configuration | — | Internal flash, JTAG, Passive Serial |
| Nivel MSL | — | 3 |