10M08DAF256C7G vs 10M16DAF256C7G Comparación
Comparación detallada lado a lado de 10M08DAF256C7G por Intel y 10M16DAF256C7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M08DAF256C7G | 10M16DAF256C7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7,95 | $13,80 |
| Family | MAX 10 | — |
| Logic Elements (LE) | 8,000 | 16000 |
| Embedded Memory (M9K blocks) | 46 (378 Kbits) | — |
| User Flash Memory | 387,072 bits (approx. 48 KB) | — |
| Maximum User I/O | 178 | 178 |
| Core Voltage | 1.2 V | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (Commercial, "C" grade) | 0C to +85C (C7G suffix = commercial) |
| Encapsulado | 256-pin LBGA (F256) | 256-LBGA (F256), 17x17 mm |
| Package Dimensions | 17 mm × 17 mm, 1.0 mm ball pitch | — |
| On-chip ADC | 12-bit, 1 MSPS, 1 channel | — |
| PLLs | 2 | [DATA_NEEDED: PLL count] |
| 18 × 18 Multipliers | 24 | — |
| Configuration | Dual-configuration internal flash (D-series) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant (Pb-free "G" suffix) | Compliant |
| Process Technology | [DATA_NEEDED: process node, typically 55 nm embedded flash] | — |
| Internal Oscillator | Yes (on-chip) | — |
| Product Family | — | MAX 10 |
| Embedded Memory Bits | — | 562176 (549 Kbit) |
| Embedded RAM Blocks | — | M9K, 69 blocks (per family datasheet) |
| Configuration Memory | — | Dual-configuration flash (non-volatile) |
| User Flash Memory (UFM) | — | [DATA_NEEDED: UFM size in kB] |
| 18x18 Hardware Multipliers | — | [DATA_NEEDED: multiplier count] |
| Integrated ADC | — | Yes, 12-bit SAR (per MAX 10 family) |
| Supply Voltage - Core | — | 1.2 V (dual-supply variants) |
| Supply Voltage - I/O | — | 3.3 V (or LVCMOS 1.2-3.3 V per bank) |
| Speed Grade | — | 7 |
| Nivel MSL | — | 3 (per JEDEC J-STD-020, BGA package) |