10M08DAF484I7G vs 10M08DAF484I7P Comparación
Comparación detallada lado a lado de 10M08DAF484I7G por Intel y 10M08DAF484I7P por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M08DAF484I7G | 10M08DAF484I7P |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,80 | $22,10 |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 8000 | 8,000 |
| Embedded Memory (bits) | 387072 | — |
| Embedded Memory (Kb) | 378 | — |
| Number of I/Os | 250 | — |
| Number of LABs/CLBs | [DATA_NEEDED: number of LABs] | — |
| Number of Logic Array Blocks | [DATA_NEEDED: LAB count] | — |
| Temperatura de funcionamiento | -40 °C to +100 °C (Industrial) | -40 C to +100 C (Industrial) |
| Supply Voltage - Core | 1.2 V | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Encapsulado / Carcasa | 484-BGA | — |
| Supplier Device Package | 484-FBGA (23x23 mm) | — |
| Process Technology | 55 nm | — |
| Estado RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Configuration Memory | Internal flash (non-volatile) | — |
| Embedded Memory | — | 378 Kbits (46,080 M9K bits) |
| User I/O Count | — | 250 |
| Encapsulado | — | 484-ball FBGA (F484) |
| Pitch | — | 1.0 mm |
| Core Voltage | — | 1.0 V |
| Speed Grade | — | -7 |
| On-chip Configuration Flash | — | Yes, dual-boot |
| Embedded ADC | — | 12-bit, 1 Msps, 16 channels |
| DSP Blocks | — | Yes (24 x 18-bit multipliers) |
| PLLs | — | 4 |
| Maximum LVDS Channels | — | [DATA_NEEDED: per-bank LVDS channel count] |
| User Flash | — | 8 Kbits (non-volatile) |
| Nivel MSL | — | [DATA_NEEDED: moisture sensitivity level] |