10M08SAU169C8G vs 10M08SAU169I7P Comparación
Comparación detallada lado a lado de 10M08SAU169C8G por Intel y 10M08SAU169I7P por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M08SAU169C8G | 10M08SAU169I7P |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,20 | $20,50 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LEs) | 8,000 | — |
| Embedded Memory (bits) | 387,072 (≈378 Kbits user flash + M9K block RAM) | — |
| User I/Os | 130 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| M9K Block RAM (Kbits) | 173 (≈378 Kbits total embedded memory including user flash) | — |
| DSP Blocks | Yes (18x18 multiplier blocks) | — |
| PLLs | 4 analog PLLs + 2 fractional PLLs | 2 |
| On-chip ADC | Yes (single, 12-bit, 1 MSps equivalent — device dependent) | — |
| Configuration Memory | Dual-configuration on-chip flash (non-volatile, instant-on) | — |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Standards | LVCMOS/LVTTL up to 3.3 V | — |
| Speed Grade | C8 (-8) | S (slowest) |
| Encapsulado | 169-LFBGA (UBGA, 11x11 mm, 0.8 mm pitch) | 169-UFBGA (UBGA-169, 11x11 mm) |
| Temperatura de funcionamiento | Commercial / Industrial (per device suffix) | -40C to +100C (Industrial) |
| Process Node | 55 nm embedded flash | — |
| External Memory Interface | DDR3, LPDDR2, SRAM (hard IP) | — |
| PCIe Hard IP | Yes (PCIe Gen2 x1 hard IP block) | — |
| Estado RoHS | Compliant | Compliant |
| Configuration Mode | JTAG (1149.1) + Active Serial (AS) | — |
| Development Toolchain | Intel Quartus Prime | — |
| Manufacturer | — | Altera (Intel) |
| Logic Elements | — | 8,000 |
| Embedded Memory | — | 387,072 bits (M9K blocks) |
| Embedded Multipliers | — | 56 (18x18) |
| Maximum User I/O | — | 130 |
| Process Technology | — | 55 nm |
| On-chip Flash | — | Yes (non-volatile configuration) |
| Tipo de montaje | — | Surface Mount (BGA) |