10M16DAU324I7P vs 10M16DCU324C8G Comparación
Comparación detallada lado a lado de 10M16DAU324I7P por Intel y 10M16DCU324C8G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M16DAU324I7P | 10M16DCU324C8G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $51,20 | $38,40 |
| Family | MAX 10 | — |
| Logic Elements | 16000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| User I/O Count | 246 | — |
| Embedded Memory | 549 kbit | — |
| Embedded Multipliers (18x18) | 246 | — |
| User Flash Memory | [DATA_NEEDED: user flash size] | 562,176 bits |
| Encapsulado | 324-LFBGA (UBGA-324) | 324-LFBGA / 324-UBGA (U324) 15x15 mm |
| Operating Supply Voltage (Core) | 1.2 V | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +100 C | — |
| Speed Grade | 7 | 8 |
| Temperature Grade | Industrial (I) | Commercial (0C to +85C) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Series | — | MAX 10 |
| Logic Elements (LE) | — | 16,000 |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count] |
| Maximum User I/O | — | 246 |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT] |
| Configuration Memory | — | Internal flash (non-volatile) |
| DSP Blocks | — | Yes (18x18 multipliers) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| On-chip ADC | — | Yes (MAX 10 integrated) |
| Nivel MSL | — | 3 |
| Lead-Free | — | Yes |