10M16DCU324I7G vs 10M16DAU324I7P Comparación
Comparación detallada lado a lado de 10M16DCU324I7G por Intel y 10M16DAU324I7P por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M16DCU324I7G | 10M16DAU324I7P |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $40,10 | $51,20 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 16,000 | 16000 |
| Adaptive Logic Modules (ALMs) | 9,920 | [DATA_NEEDED: ALM count] |
| User I/O Count (Maximum) | 246 | — |
| Embedded Memory (M9K Blocks) | 558 Kbits | — |
| Distributed Logic RAM | 12.5 Kbits | — |
| Embedded User Flash | 562,176 bits (70 KB) | — |
| Embedded 18x18 Multipliers | 45 | — |
| PLLs | 4 | — |
| Maximum LVDS Channels | 125 | — |
| Encapsulado | 324-UBGA (U324), 15 x 15 mm, 0.8 mm pitch | 324-LFBGA (UBGA-324) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Process Technology | 55 nm NOR-flash-based CMOS | — |
| Configuration Memory | On-die dual-configuration flash | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| User I/O Count | — | 246 |
| Embedded Memory | — | 549 kbit |
| Embedded Multipliers (18x18) | — | 246 |
| User Flash Memory | — | [DATA_NEEDED: user flash size] |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +100 C |
| Speed Grade | — | 7 |
| Temperature Grade | — | Industrial (I) |