10M16SAE144C8G vs 10M08SAE144C8G Comparación
Comparación detallada lado a lado de 10M16SAE144C8G por Intel y 10M08SAE144C8G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
10M08SAE144C8G - MAX 10 FPGA 8K LE, 144-EQFP | Intel | Industrial Control
10M08SAE144C8G ✓ ActivoComparación de especificaciones
| Parámetro | 10M16SAE144C8G | 10M08SAE144C8G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,01 | $16,25 |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements | 16,000 | — |
| Number of LABs/CLBs | 1,000 | — |
| Total RAM Bits | 562,176 | — |
| Embedded SRAM | 549 Kbit (M9K blocks) | — |
| Number of User I/O | 101 | — |
| Number of GPIO | 101 | — |
| Supply Voltage (Core) | 3.0 V / 3.3 V single supply | — |
| Process Technology | 55 nm TSMC with embedded flash | 55 nm flash-based CMOS |
| Configuration Memory | Internal dual-configuration flash (non-volatile) | Internal flash, dual-image |
| Integrated ADC | 12-bit, 1 MSPS (MAX 10 hard IP) | 12-bit, 1 MSa/s, up to 17 analog inputs |
| DSP Blocks (18x18 multipliers) | 16 to 24 [DATA_NEEDED: DSP block count for 10M16 E144] | — |
| PLLs | Up to 4 [DATA_NEEDED: exact PLL count for 10M16 E144] | 2 analog front-end PLLs |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial, C8G grade) | — |
| Speed Grade | 8 (C8G) | — |
| Encapsulado | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP) |
| Tipo de montaje | Surface Mount | Surface Mount (LQFP) |
| Lead-Free / RoHS | Compliant per manufacturer product page | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Estado del ciclo de vida | Active | — |
| Logic Elements (LE) | — | 8000 |
| Adaptive Logic Modules (ALM) | — | Not applicable (MAX 10 uses LE architecture, not ALM) |
| M9K Embedded Memory Blocks | — | 378 Kb total |
| MLAB Memory | — | [DATA_NEEDED: MLAB capacity] |
| Embedded 18x18 Multipliers | — | 24 |
| User I/O Pins | — | 101 |
| Maximum User I/O Voltage | — | 3.3 V (LVCMOS/LVTTL); LVDS supported |
| External Memory Interface | — | DDR3, DDR2, LPDDR2 |
| Temperatura de unión de funcionamiento | — | 0C to 85C (commercial) |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Sin halógenos | — | [DATA_NEEDED: halogen status] |