10M25DAF484A7G vs 10M16DAF484A7G Comparación
Comparación detallada lado a lado de 10M25DAF484A7G por Intel y 10M16DAF484A7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M25DAF484A7G | 10M16DAF484A7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,75 | $12,10 |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | — |
| Embedded Memory (bits) | 691,200 | — |
| Embedded Memory Blocks | 360 (M9K) | — |
| 18x18 Multipliers | 25 | — |
| User I/O Pins | 360 | — |
| Encapsulado | 484-ball BGA | 484-BGA (FineLine BGA) |
| Temperatura de funcionamiento | -40C to +125C (automotive) | -40C to +125C (industrial) |
| Configuration Memory | On-chip flash (non-volatile) | — |
| PLLs | 8 | 4 |
| Global Clock Networks | 16 | — |
| On-chip ADC | 12-bit SAR, 16 channels, up to 1 Msps | — |
| Hard Memory Controller | DDR3 / LPDDR3 | — |
| Core Voltage | 1.2 V | 1.0 V (internal regulator) |
| I/O Voltage | 2.5 V / 3.3 V (bank-dependent) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Product Family | — | MAX 10 |
| Series | — | 10M16 |
| Logic Elements (LE) | — | 16,000 |
| Embedded Memory (SRAM) | — | 320 Kbits |
| Embedded User Flash | — | 562,176 bits |
| Supply Variant | — | DA (Dual-supply, with ADC) |
| Configuration Mode | — | Internal flash, dual-image supported |
| ADC Blocks | — | Yes (integrated, on DA variants) |
| User I/O Banks | — | 8 |
| Maximum User I/O | — | 320 |
| DSP Blocks | — | Yes |