10M40DAF256I7G vs 10M40DCF256A7G Comparación
Comparación detallada lado a lado de 10M40DAF256I7G por Intel y 10M40DCF256A7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M40DAF256I7G | 10M40DCF256A7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $65,80 | $21,80 |
| Series | MAX 10 | — |
| Logic Elements (LE) | 40,000 | 40,000 |
| Embedded Memory (bits) | 1,290,240 (M9K + M144K blocks) | 1,290,240 (160 Kbytes) |
| User I/O Count | 178 | — |
| Encapsulado | 256-FBGA (FineLine BGA), 17x17 mm | 256-FBGA (FineLine BGA, 17 mm x 17 mm, 1.0 mm pitch) |
| Process Technology | 55 nm TSMC | 55 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I7) | — |
| Maximum Internal Frequency | 472.5 MHz | 472.5 MHz |
| Number of PLLs | 4 | — |
| Embedded Multipliers (18x18) | 56 | — |
| ADC | 12-bit SAR, up to 16 channels, 1 MSPS | — |
| Configuration Memory | On-chip dual-configuration flash | On-chip dual-configuration flash |
| PCIe Hard IP | PCIe Gen2 x1/x2 (soft IP in 256-FBGA variant) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Nivel MSL | 3 (168 hours) | — |
| Estado RoHS | Compliant | Compliant |
| Estilo de montaje | SMD/SMT | — |
| Lead-Free / Halogen-Free | Yes / Yes | Yes (per device family) |
| Family | — | MAX 10 |
| Maximum User I/Os | — | 178 |
| Embedded Memory Type | — | M9K blocks |
| ADC Channels | — | Up to 16 (12-bit) |
| DSP Blocks (18x18 Multipliers) | — | [DATA_NEEDED: DSP block count] |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Operating Temperature Grade | — | Automotive / -40C to +125C (per Partstack grading) |