10M50DCF484I7G vs 10M25DCF484I7G Comparación
Comparación detallada lado a lado de 10M50DCF484I7G por Intel y 10M25DCF484I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M50DCF484I7G | 10M25DCF484I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $99,60 | $45,10 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 50,000 | 25,000 |
| Embedded SRAM | 1,677,312 bits (1.6 Mb) | — |
| User Flash Memory | Up to 5,888 Kb (on-chip dual configuration) | — |
| Maximum User I/O Pins | 360 | — |
| LVDS Channels (dedicated) | 160 (rx + tx) | — |
| PLLs | 4 | Up to 4 |
| 18x18 Hardware Multipliers | 144 | — |
| Encapsulado | 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch | 484-ball FineLine BGA (F484) |
| Core Voltage | 1.2 V (internal) | — |
| Process Technology | TSMC 55 nm embedded flash | 55 nm TSMC |
| Temperatura de unión de funcionamiento | -40C to +100C (industrial, 'I' suffix) | — |
| Speed Grade | 7 (fastest commercial/industrial) | — |
| Configuration Mode | On-chip flash + JTAG | — |
| Integrated ADC | 12-bit, up to 17 channels, 1 MSPS | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Embedded Memory | — | 1,728 Kbits (M9K blocks) |
| User I/O Pins | — | 360 |
| Ball Pitch | — | 1.0 mm |
| Tensión de alimentación | — | 1.2 V core |
| Configuration Memory | — | 5 Mb on-chip flash |
| Temperature Grade | — | Industrial (-40C to +100C), I7 suffix |
| Multiplier Blocks | — | [DATA_NEEDED: 18x18 multiplier count] |
| Temperatura de funcionamiento | — | -40C to +100C |