5CGXBC9D6F27C7N vs 5CEFA9F27C7N Comparación
Comparación detallada lado a lado de 5CGXBC9D6F27C7N por Intel y 5CEFA9F27C7N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 5CGXBC9D6F27C7N | 5CEFA9F27C7N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $289,00 | $295,00 |
| Family | Cyclone V GX | Cyclone V E |
| Logic Elements | 301,000 | 301,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits (14.25 Mbit) |
| Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| Embedded Multipliers (18x18) | 336 | — |
| Transceivers | GX family transceivers (per package variant) | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| PCIe Hard IP | Yes, Gen1/Gen2 | — |
| Core Voltage | 1.1 V | — |
| I/O Voltage Support | 1.2 V to 3.3 V (bank-dependent) | — |
| User I/O Pins | [DATA_NEEDED: user I/O count for FBGA-672] | 336 |
| Process Technology | 28 nm TSMC low-power | 28 nm TSMC low-power |
| Encapsulado | 672-ball FBGA | 672-ball FBGA (FineLine BGA) |
| Speed/Grade | C7 (commercial, speed grade 7) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant | Compliant |
| Supply Voltage (Core) | — | 1.13 V |
| Maximum Operating Frequency | — | 800 MHz |
| Package Body Size | — | 27 mm (F27) |
| Speed Grade | — | C7 (commercial) |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Packaging | — | Tray (40 units per tray) |
| Lead-Free | — | Yes |