5CGXFC5C6F27C7N vs 5AGXMA3D4F27I5G Comparación
Comparación detallada lado a lado de 5CGXFC5C6F27C7N por Intel y 5AGXMA3D4F27I5G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 5CGXFC5C6F27C7N | 5AGXMA3D4F27I5G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $118,00 | $580,25 |
| Family | Cyclone V GX | Arria V GX |
| Logic Elements | 77,000 | — |
| Embedded Memory | 5,001,216 bits | — |
| Number of M10K Blocks | 446 | — |
| Number of MLAB Blocks | 832 | — |
| User I/O Pins | 336 | — |
| Hard Memory Controllers | 2 | — |
| Logic Array Blocks (LABs) | 4,535 | — |
| 18x18 Multipliers | 312 | — |
| PLLs (Fractional) | 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Transceiver Channels | 6 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | — |
| Encapsulado | 672-FBGA (27 mm x 27 mm, 1.0 mm pitch) | 672-ball FCBGA (F27) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm |
| Series | Cyclone V | — |
| Supplier Device Package | 672-FBGA | — |
| Logic Elements (LE) | — | 156,000 |
| Embedded Memory Bits | — | 11,746,304 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| General-Purpose I/Os | — | 336 |
| Package Body Size | — | 27 x 27 mm |
| Seated Height | — | 2.7 mm |
| Transceivers | — | Integrated multi-gigabit transceivers |
| Hard IP Blocks | — | PCIe Gen2, memory controllers |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Configuration | — | JTAG, serial flash, passive parallel |