5CSEBA4U19A7N vs 5CSEBA4U19C7N Comparación
Comparación detallada lado a lado de 5CSEBA4U19A7N por Intel y 5CSEBA4U19C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
5CSEBA4U19C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U19C7N ✓ ActivoComparación de especificaciones
| Parámetro | 5CSEBA4U19A7N | 5CSEBA4U19C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $99,90 | $36,92 |
| Family | Cyclone V SE SoC FPGA | 5CSEBA4 (U19 device) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Logic Elements | 40 K | 40 K |
| Adaptive Logic Modules | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 3.4 Mbits (M9K) | [DATA_NEEDED: total Kbits of embedded RAM] |
| DSP Blocks (18x18 Multipliers) | 224 | — |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| HPS Maximum Application Clock | 925 MHz | — |
| Memory Interfaces | DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA | — |
| User I/O | 161 | — |
| Encapsulado | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch | 484-pin UBG A (UBGA), 19x19 mm |
| Tipo de montaje | Surface Mount (BGA) | — |
| Temperatura de unión de funcionamiento | -40C to +125C (automotive) / -40C to +100C (industrial) | — |
| Process Node | TSMC 28 nm low-power | — |
| Core Voltage | 1.1 V (typical) | 1.1 V |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (168 hours) | — |
| Series | — | Cyclone V SE SoC FPGA |
| HPS Cores | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | — | 800 MHz |
| DSP Blocks | — | Variable-precision DSP (number not specified in data) |
| Embedded Multipliers | — | 56 (18x18) |
| Hard Memory Controllers | — | 2 |
| Hard USB 2.0 OTG | — | Yes |
| Hard PCIe Gen2 | — | Yes (rootport/endpoint configurable) |
| Process Technology | — | 28 nm low-power |
| Temperatura de funcionamiento | — | 0 C to +85 C (commercial) |
| AES Encryption | — | Supported |
| SEU Error Detection/Correction | — | Supported |
| Configuration Interface | — | JTAG |