5CSEBA4U23A7N vs 5CSEBA4U23C7N Comparación
Comparación detallada lado a lado de 5CSEBA4U23A7N por Altera y 5CSEBA4U23C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
5CSEBA4U23C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7N ✓ ActivoComparación de especificaciones
| Parámetro | 5CSEBA4U23A7N | 5CSEBA4U23C7N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $185,00 | $124,50 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA4 | 5CSEA4 (Logic Element density) |
| Logic Elements | 40 K | 40,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz | — |
| Encapsulado | 672-pin UBGA (U23, 23x23 mm) | 672-ball UBGAs (UBGA), 23x23 mm |
| Process Node | 28 nm low power | — |
| DSP Blocks | Variable-precision DSP blocks (Cyclone V SE family feature) | — |
| Embedded Memory | M10K memory blocks (family feature) | Approximately 2.7 Mbits (M10K + M9K) |
| Speed Grade | 7 | — |
| Temperatura de funcionamiento | [DATA_NEEDED: industrial temp range explicit value] | Commercial 0C to +85C (C7 speed grade) |
| Family Maximum Logic Elements | Up to 301 K LE | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0, SATA, UART, SPI, I2C, CAN | — |
| FPGA-HPS Interface | ARM AMBA AXI coherence fabric | — |
| HPS Maximum Core Frequency | — | 800 MHz |
| DSP Blocks (18x18) | — | 224 |
| Core Voltage | — | 1.1 V |
| User I/O Count | — | 364 |
| High-Speed Transceivers | — | 6 (up to 3.125 Gbps) |
| PCIe Hard IP | — | 2 Gen2 blocks |
| Process Technology | — | TSMC 28 nm low-power |
| HPS Memory Interface | — | DDR3, DDR3L, LPDDR2 (16-bit + ECC option) |