5CSEBA6U19C7N vs 5CSEBA5U19I7N Comparación
Comparación detallada lado a lado de 5CSEBA6U19C7N por Intel y 5CSEBA5U19I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
5CSEBA6U19C7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 | Intel
5CSEBA6U19C7N ✓ ActivoIntel
5CSEBA5U19I7N - Cyclone V SE SoC FPGA 85K LE Dual ARM Cortex-A9 | Intel
5CSEBA5U19I7N ✓ ActivoComparación de especificaciones
| Parámetro | 5CSEBA6U19C7N | 5CSEBA5U19I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $155,29 | $119,85 |
| Product Type | SoC FPGA (System-on-Chip) | SoC FPGA (System-on-Chip FPGA) |
| Series | Cyclone V SE | Cyclone V SE |
| Family | Cyclone V | — |
| Logic Elements | 110,000 | 85,000 |
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 925 MHz | — |
| FPGA Maximum Frequency | 800 MHz | — |
| Process Technology | 28 nm low-power | 28 nm TSMC low-power |
| Encapsulado | 484-UBGA (U19) 19x19 mm | 484-pin UBG (UFBGA) 19x19 mm |
| Recuento de pines | 484 | — |
| User I/O | 66 | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial / Commercial | — |
| Memory Interface | DDR3 with ECC (via HPS) | — |
| Estado RoHS | Compliant | Compliant (per Heisener listing and product family) |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency | — | 800 MHz (typical), up to 925 MHz |
| Tensión de alimentación | — | 1.1 V core |
| FPGA User I/O | — | 66 (per datasheet front-page snippet) |
| Embedded Memory | — | Approximately 4,450 Kbits |
| DSP Blocks | — | 87 variable-precision (18x18 multipliers) |
| Transceivers | — | Up to 5 Gbps (Cyclone V SE feature) |
| HPS Peripherals | — | USB 2.0 OTG, EMAC, CAN, SPI, I2C, UART, SD/MMC, NAND |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial grade, suffix I) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |