5CSEBA6U19I7SN vs 5CSEBA6U19I7N Comparación
Comparación detallada lado a lado de 5CSEBA6U19I7SN por Intel y 5CSEBA6U19I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
5CSEBA6U19I7N ✓ ActivoComparación de especificaciones
| Parámetro | 5CSEBA6U19I7SN | 5CSEBA6U19I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $305,00 | $142,75 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Hard Processor System (HPS) | Single-core ARM Cortex-A9 MPCore with CoreSight | — |
| Logic Elements (LEs) | 110,000 | — |
| Logic Array Blocks (LABs) | 4150 | — |
| Maximum User I/Os | 66 | — |
| On-chip Memory | 64 KB | — |
| DSP Blocks | Variable-precision DSP blocks | 112 (18x18 multipliers) |
| PLLs | Integrated phase-locked loops | 6 (FPGA) + 3 (HPS) |
| HPS Maximum Frequency | 800 MHz | 800 MHz |
| External Memory Support | DDR3, DDR3L, LPDDR2 (via HPS) | — |
| Process Technology | 28 nm low-power (TSMC) | TSMC 28 nm low-power |
| Encapsulado | 484-pin UBGA (19x19 mm) | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | Industrial grade (I) -40C to +100C junction | -40C to +100C (Industrial) |
| Estado RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Ordering Part Number | 5CSEBA6U19I7SN | — |
| Series | — | 5CSEBA6 |
| Device Variant | — | 5CSEA6 (U19 package, 110K LE) |
| Logic Elements | — | 110,000 |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore |
| Embedded Memory | — | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | — | DDR3, DDR3L, LPDDR2 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| User I/O Banks | — | 8 |
| Maximum User I/O | — | 288 (package-dependent) |
| Tensión de alimentación | — | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |