5CSEBA6U23I7LN vs 5CSEBA6U23C8SN Comparación
Comparación detallada lado a lado de 5CSEBA6U23I7LN por Intel y 5CSEBA6U23C8SN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
5CSEBA6U23C8SN - Cyclone V SE SoC FPGA, 110K LE, ARM Cortex-A9 | Intel
5CSEBA6U23C8SN ✓ ActivoComparación de especificaciones
| Parámetro | 5CSEBA6U23I7LN | 5CSEBA6U23C8SN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $184,83 | $1.420,00 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 | 110,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum CPU Clock | 925 MHz | — |
| Encapsulado | 672-pin UBGA (UBG-672) 23x23 mm | 672-ball UBGA (23x23 mm) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Speed Grade | I7 (fast) | — |
| Temperature Range | Industrial (-40C to +100C junction) | — |
| Suffix L | Lead-free | — |
| Suffix N | Tray packaging | — |
| Estado RoHS | Compliant (lead-free suffix) | Compliant |
| Hard Memory Blocks | [DATA_NEEDED: total M10K and MLAB bits] | — |
| DSP Blocks | [DATA_NEEDED: variable-precision DSP block count] | 224 (18x18 multipliers) |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/SDIO | Gigabit Ethernet, USB 2.0 OTG, NAND, SD/MMC, I2C, SPI, UART |
| Configuration Mode | JTAG and Active Serial (AS) | — |
| Process Node | TSMC 28 nm low-power | — |
| Design Toolchain | Intel Quartus Prime + SoC EDS | — |
| Device Designator | — | 5CSEBA6 (U23 speed grade, 8 speed) |
| HPS Processor | — | Single ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | — | 600 MHz |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | — | DDR2/DDR3 with ECC (HPS) |
| Maximum User I/O | — | [DATA_NEEDED: user I/O count for U23 package] |
| LVDS Channels | — | Up to 17 (875 Mbps) |
| Process Technology | — | TSMC 28 nm low-power |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature grade] |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |