A3P1000-FG256M vs A3P1000-2FG256M Comparación
Comparación detallada lado a lado de A3P1000-FG256M por Microchip Technology y A3P1000-2FG256M por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P1000-FG256M - ProASIC3 Flash FPGA 1M Gates 256-FBGA | Microchip
A3P1000-FG256M ✓ ActivoMicrochip Technology
A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip
A3P1000-2FG256M ✓ ActivoComparación de especificaciones
| Parámetro | A3P1000-FG256M | A3P1000-2FG256M |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $50,87 | $45,10 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 1000000 gates | — |
| VersaTiles (Logic Elements) | 24576 | — |
| User I/O | 177 | — |
| Configuration Memory | 147456 bits flash | — |
| Maximum System Performance | 231 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| I/O Supply Voltage (VCCIBx) | [DATA_NEEDED: I/O bank voltage range] | — |
| Technology | CMOS flash-based FPGA | 130 nm CMOS, flash-based |
| Architecture | VersaTile (3-input LUT / D-flip-flop / latch) | — |
| I/O Banks | 4 | 4 banks (banked VCCIB) |
| Soft Processor Support | Optional soft ARM support | — |
| Encapsulado | 256-LBGA (FBGA-256) | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Programmability | In-system reprogrammable, non-volatile flash | Reprogrammable, non-volatile flash |
| Configuration | Single-chip, instant-on (no external boot ROM) | Single-chip, instant-on (no external config PROM) |
| Logic Elements | — | 11000 LE |
| Number of I/Os | — | 177 I/O |
| System Frequency | — | 310 MHz |
| Tensión de alimentación de funcionamiento | — | 1.5 V |
| Speed Grade | — | 2 |
| Encapsulado / Carcasa | — | FBGA-256 (256-LBGA) |
| Estilo de montaje | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Series | — | A3P1000 |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |