A3P1000-FGG256M vs A3P1000-FG256M Comparación

Comparación detallada lado a lado de A3P1000-FGG256M por Microchip Technology y A3P1000-FG256M por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
A3P1000-FGG256M A3P1000-FGG256M ProASIC3 FPGA 256-LBGA | Microchip

A3P1000-FGG256M ProASIC3 FPGA 256-LBGA | Microchip

A3P1000-FGG256M ✓ Activo
Microchip Technology
A3P1000-FG256M A3P1000-FG256M - ProASIC3 Flash FPGA 1M Gates 256-FBGA | Microchip

A3P1000-FG256M - ProASIC3 Flash FPGA 1M Gates 256-FBGA | Microchip

A3P1000-FG256M ✓ Activo

Comparación de especificaciones

Parámetro A3P1000-FGG256M A3P1000-FG256M
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $27,85 $50,87
Series ProASIC3 —
Number of Logic Elements 11KLEs —
Number of I/O 177 —
RAM Bits 147456 —
Number of I/O Banks 4 —
Encapsulado / Carcasa 256-LBGA —
Tipo de montaje Surface Mount Surface Mount
Supplier Package FBGA —
Core Supply Voltage [DATA_NEEDED: Core Supply Voltage] 1.5 V
Rango de temperatura de funcionamiento [DATA_NEEDED: Operating Temperature Range] —
Maximum Operating Frequency [DATA_NEEDED: Maximum Operating Frequency] —
Speed Grade [DATA_NEEDED: Speed Grade] —
Total System Gates [DATA_NEEDED: Total System Gates] —
I/O Standards Supported [DATA_NEEDED: I/O Standards Supported] —
Estado RoHS [DATA_NEEDED: RoHS Status] —
Family — ProASIC3
System Gates — 1000000 gates
VersaTiles (Logic Elements) — 24576
User I/O — 177
Configuration Memory — 147456 bits flash
Maximum System Performance — 231 MHz
I/O Supply Voltage (VCCIBx) — [DATA_NEEDED: I/O bank voltage range]
Technology — CMOS flash-based FPGA
Architecture — VersaTile (3-input LUT / D-flip-flop / latch)
I/O Banks — 4
Soft Processor Support — Optional soft ARM support
Encapsulado — 256-LBGA (FBGA-256)
Temperatura de funcionamiento — [DATA_NEEDED: operating temperature range]
Programmability — In-system reprogrammable, non-volatile flash
Configuration — Single-chip, instant-on (no external boot ROM)

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