A3P600-2FG256I vs M7AFS600-FG256I Comparación
Comparación detallada lado a lado de A3P600-2FG256I por Microchip Technology y M7AFS600-FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P600-2FG256I - ProASIC3 Flash FPGA 256-FBGA | Microchip
A3P600-2FG256I ✓ ActivoMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ ActivoComparación de especificaciones
| Parámetro | A3P600-2FG256I | M7AFS600-FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $44,40 | $0,00 |
| Manufacturer Series | ProASIC3 (A3P600) | — |
| Logic Elements (LEs) | 7K LEs (approximately) | — |
| Configuration Memory | 110592 bits (flash, non-volatile) | — |
| Number of I/Os | 177 I/O | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Speed Grade | -2 | — |
| Temperature Range | -40C to +85C (industrial, suffix I) | — |
| Encapsulado | 256-FBGA (LBGA) | — |
| Estilo de montaje | SMD/SMT | SMD/SMT |
| Configuration Technology | Flash (single-chip, no external PROM) | — |
| Reprogrammability | Yes (in-system reprogrammable) | — |
| Power-up Behavior | Live at power-up (instant-on) | — |
| I/O Banks | 4 I/O banks with dedicated VCCIBx supplies | — |
| Logic Architecture | VersaTile (3-input LUT / D-FF / latch with enable) | — |
| Estado RoHS | [DATA_NEEDED: RoHS Status] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Series | — | M7AFS600 (Fusion) |
| System Gates | — | 600K |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| Process Technology | — | 130 nm |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |