A3P600-2FGG484I vs A3P600L-FG484I Comparación
Comparación detallada lado a lado de A3P600-2FGG484I por Microchip Technology y A3P600L-FG484I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P600-2FGG484I - ProASIC3 FPGA 600K 235 I/O | Microchip
A3P600-2FGG484I ✓ ActivoMicrochip Technology
A3P600L-FG484I - ProASIC3L Flash FPGA 600K Gates | Microchip
A3P600L-FG484I ✓ ActivoComparación de especificaciones
| Parámetro | A3P600-2FGG484I | A3P600L-FG484I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $31,80 | $45,60 |
| Family | ProASIC3 | ProASIC3L |
| System Gates | 600000 | 600000 |
| User I/O | 235 | 235 |
| On-chip Resource Bits | 110592 | — |
| Speed Grade | -2 (25% faster than standard) | — |
| Encapsulado | 484-BGA (FGG484) | 484-ball FBGA (FG484) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Memory | Flash (non-volatile, single-chip) | Nonvolatile flash, single-chip, Instant On |
| Temperatura de funcionamiento | -40C to +100C (industrial, I suffix) | [DATA_NEEDED: exact operating temperature range] |
| I/O Banks | 4 (dedicated VCCIBx per bank) | — |
| Reprogrammability | Yes, in-system | Yes, in-system reprogrammable flash fabric |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V to 1.5 V |
| Lead Free | Yes (per PCB Electronics: LEAD FREE) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| Architecture | CMOS flash-based FPGA sea-of-gates | — |
| Logic Cells | — | 13824 |
| Technology | — | 130 nm flash CMOS |
| Package Dimensions | — | 23 x 23 mm, 1.0 mm ball pitch |
| Package Height | — | 2.23 mm |
| Temperature Grade | — | I (Industrial) |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O bank voltage range] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |