A3P600-FG256 vs A3P600-FGG256I Comparación
Comparación detallada lado a lado de A3P600-FG256 por Microchip Technology y A3P600-FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ ActivoMicrochip Technology
A3P600-FGG256I - ProASIC3 Flash FPGA 600K Gates | Microchip
A3P600-FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | A3P600-FG256 | A3P600-FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $48,90 | $96,23 |
| Family | ProASIC3 (Flash FPGAs) | ProASIC3 |
| System Gates | 600000 | 600K |
| Logic Elements | 7K LEs (VersaTiles) | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| User I/O | 177 | 177 |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm |
| Maximum System Performance | Approx. 231 MHz | — |
| Configuration Technology | On-chip flash, reprogrammable, single-chip | Flash (nonvolatile, single-chip) |
| Power-Up Behavior | Instant On Level 0 support | — |
| Encapsulado | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) | 256-Ball FBGA (FGG256) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0 C to 85 C (TJ) | -40C to +85C |
| I/O Banks | 4 (independent VCCIBx supplies) | 4 |
| Packaging | Tray | — |
| Estado RoHS | RoHS non-compliant (per Microchip USA listing) | Compliant |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Elements (D-Registers) | — | 13824 |
| Embedded RAM | — | 110592 bits |
| Maximum System Frequency | — | 231 MHz |
| Lead-Free | — | Yes |
| Typical Applications | — | Signal processing, industrial automation, communications, hardware acceleration |