A3P600-FG256I vs A3P600-1FG256 Comparación
Comparación detallada lado a lado de A3P600-FG256I por Microchip Technology y A3P600-1FG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P600-FG256I - ProASIC3 FPGA, 600K Gates | Microchip Technology
A3P600-FG256I ✓ ActivoComparación de especificaciones
| Parámetro | A3P600-FG256I | A3P600-1FG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $23,10 | $51,28 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | ProASIC3 | — |
| System Gates | 600,000 | 600000 |
| Logic Elements / VersaTiles | 13,824 VersaTiles (7K logic elements per Mouser) | [DATA_NEEDED: Logic elements/VersaTiles] |
| Total RAM Bits | 110,592 | 110592 bits |
| Number of User I/O | 177 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Maximum Internal Frequency | [DATA_NEEDED: accurate maximum frequency; distributor listings cite 231 MHz or 350 MHz] | — |
| Encapsulado | 256-LBGA (FBGA-256) | — |
| Package Dimensions | 17 x 17 mm, 1.6 mm height, 1 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: exact industrial temperature range (I suffix)] | 0°C to 70°C |
| Programming Technology | Nonvolatile Flash | — |
| Reprogrammability | In-system programmable | — |
| I/O Supply Voltage Range | [DATA_NEEDED: exact I/O bank voltage range] | — |
| Estado RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| Estado del ciclo de vida | active per DigiKey (ships today) | — |
| FPGA Family | — | ProASIC3 |
| Max System Performance | — | 272 MHz |
| Process Technology | — | 130nm CMOS |
| User I/O Count | — | 177 |
| I/O Banks | — | 4 |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA-256) |
| Número de pines | — | 256 |
| Configuration Memory | — | Flash-based (non-volatile) |
| Embedded Flash Size | — | [DATA_NEEDED: Embedded flash size] |
| Supported I/O Standards | — | [DATA_NEEDED: Supported I/O standards] |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |