A3P600-FGG256 vs A3P600-FG256 Comparación
Comparación detallada lado a lado de A3P600-FGG256 por Microchip Technology y A3P600-FG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P600-FGG256 - 600K Gate ProASIC3 FPGA | Microchip Technology
A3P600-FGG256 ✓ ActivoMicrochip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ ActivoComparación de especificaciones
| Parámetro | A3P600-FGG256 | A3P600-FG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $15,40 | $48,90 |
| Family | ProASIC3 | ProASIC3 (Flash FPGAs) |
| Number of System Gates | 600000 | — |
| Number of Logic Elements/Cells | 7KLEs (Mouser term) | — |
| Total RAM Bits | 110592 | — |
| Number of I/O | 177 | — |
| Voltage - Supply | 1.425V ~ 1.575V | — |
| Supply Voltage (Nominal) | 1.5V | — |
| Temperatura de funcionamiento | 0°C ~ 85°C (TJ) | 0 C to 85 C (TJ) |
| Encapsulado / Carcasa | 256-LBGA | — |
| Supplier Device Package | 256-FPBGA (17x17) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Estado RoHS | ROHS3 Compliant | RoHS non-compliant (per Microchip USA listing) |
| Product Status | Active | — |
| Manufacturer Lead Time | 8 weeks | 8 weeks |
| Number of Terminals | 256 | — |
| Terminal Form | BALL | — |
| Package Shape | SQUARE | — |
| Maximum System Frequency | 231 MHz | — |
| System Gates | — | 600000 |
| Logic Elements | — | 7K LEs (VersaTiles) |
| Embedded SRAM | — | 110592 bits (True Dual-Port) |
| User I/O | — | 177 |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Maximum System Performance | — | Approx. 231 MHz |
| Configuration Technology | — | On-chip flash, reprogrammable, single-chip |
| Power-Up Behavior | — | Instant On Level 0 support |
| Encapsulado | — | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) |
| I/O Banks | — | 4 (independent VCCIBx supplies) |