A3P600L-1FGG484 vs A3PE600-1FGG484 Comparación
Comparación detallada lado a lado de A3P600L-1FGG484 por Microchip Technology y A3PE600-1FGG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P600L-1FGG484 - 600K Gate Flash FPGA | Microchip | FBGA-484
A3P600L-1FGG484 ✓ ActivoMicrochip Technology
A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
A3PE600-1FGG484 ✓ ActivoComparación de especificaciones
| Parámetro | A3P600L-1FGG484 | A3PE600-1FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $30,40 | $44,90 |
| Family | ProASIC3L | ProASIC3E |
| Total Gates | 600000 | — |
| Logic Cells (CLBs) | 13824 | — |
| Frecuencia de reloj máxima | 350 MHz | — |
| Core Supply Voltage | 1.2 V | 1.425 V to 1.575 V (1.5 V nominal) |
| I/O Count | 235 | — |
| RAM Bits | 110592 | — |
| Encapsulado | 484-FBGA (23x23 mm, 1.00 mm pitch) | 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch |
| Technology | 130 nm CMOS | — |
| Flash*Freeze Current | 5 mA (typical) | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (Green) | ROHS3 Compliant |
| Terminal Pitch | 1.00 mm | — |
| Height | 2.23 mm | — |
| System Gates | — | 600000 |
| Logic Cells / CLBs | — | 13824 |
| User I/Os (this package) | — | 270 |
| Max User I/Os (family) | — | 616 |
| Embedded SRAM | — | 110592 bits (504 kbits true dual-port max per family data) |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | — | On-chip flash, live at power-up (Level 0) |
| Speed Grade | — | -1 |
| Temperatura de funcionamiento | — | 0 C to +85 C (TJ) |
| Packaging | — | Tray |
| Product Status | — | Active |
| Manufacturer Lead Time | — | 8 weeks |
| Reprogrammability | — | Yes, single-chip solution, no external boot device |