A3P600L-1FGG484I vs A3P600L-FG484 Comparación
Comparación detallada lado a lado de A3P600L-1FGG484I por Microchip Technology y A3P600L-FG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P600L-FG484 - ProASIC3L Low Power FPGA 600K Gates | Microchip
A3P600L-FG484 ✓ ActivoComparación de especificaciones
| Parámetro | A3P600L-1FGG484I | A3P600L-FG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,10 | $85,90 |
| Manufacturer | Microchip Technology | — |
| Product Type | FPGA - Field Programmable Gate Array | — |
| Series | ProASIC3L | — |
| Total System Gates | 600000 | — |
| Number of Logic Elements / Cells | 13824 | — |
| Total RAM Bits | 110592 bits | 110592 |
| Number of I/O | 235 | — |
| Maximum Operating Frequency | 350 MHz | — |
| Core Supply Voltage | 1.2 V | 1.14 V to 1.575 V |
| Technology | CMOS 130 nm | CMOS, non-volatile flash based |
| Encapsulado / Carcasa | 484-BGA (FBGA), 23 x 23 mm | — |
| Número de pines | 484 | — |
| Speed Grade | -1 | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: Operating Temperature Range] | — |
| Estilo de montaje | [DATA_NEEDED: Mounting Style] | — |
| RoHS | [DATA_NEEDED: RoHS Status] | — |
| ECCN | [DATA_NEEDED: ECCN] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL] | — |
| Family | — | ProASIC3L (Flash FPGAs) |
| System Gates | — | 600000 |
| Logic Cells / CLBs | — | 13824 |
| User I/Os | — | 235 |
| Max Operating Frequency | — | 350 MHz (family rating) |
| Encapsulado | — | 484-FBGA (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) |
| Tipo de montaje | — | Surface Mount |
| Temperatura de funcionamiento | — | 0C to +85C (TJ) |
| Special Features | — | Flash*Freeze low-power standby technology |
| Configuration | — | Single-chip, on-chip flash (no external boot device) |
| Packaging | — | Tray |
| Estado RoHS | — | Non-compliant (per Microchip USA listing) |
| Manufacturer Lead Time | — | 8 weeks |
| Product Status | — | Active |