A3PE3000-2FG324 vs A3PE3000L-1FG324I Comparación
Comparación detallada lado a lado de A3PE3000-2FG324 por Microchip Technology y A3PE3000L-1FG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-2FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FG324 ✓ ActivoMicrochip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-2FG324 | A3PE3000L-1FG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $59,00 | $135,00 |
| Family | ProASIC3E | ProASIC3L Low Power Flash FPGA |
| Number of Gates | 3000000 | — |
| Logic Elements | 35000 | 35K LEs (75264 D-flip-flops equivalent family density) |
| Number of I/Os | 221 | — |
| System Frequency (Max) | 310 MHz | — |
| Process Technology | 130 nm flash | 130 nm CMOS flash |
| Supply Voltage - Core | 1.5 V (1.425 V to 1.575 V) | — |
| Encapsulado / Carcasa | 324-BGA (324-FBGA, 19x19 mm) | — |
| Estilo de montaje | SMD/SMT | — |
| Temperatura de funcionamiento | 0 C to +85 C (TJ) | -40C to +100C (industrial, I suffix) |
| Packaging | Tray | — |
| Programmability Type | In-System Reprogrammable Flash | — |
| Manufacturer Lead Time | 8 weeks | — |
| Estado RoHS | Non-compliant | — |
| Product Status | Active | — |
| Series | A3PE3000 (ProASIC3E) | — |
| System Gates | — | 3000000 |
| User I/O | — | 221 |
| Total RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V to 1.5 V |
| I/O Voltage | — | 1.2 V to 1.5 V (family range) |
| Speed Grade | — | -1 |
| Configuration Memory | — | Non-volatile on-chip flash (single chip, secure) |
| Low Power Feature | — | Flash*Freeze technology |
| Encapsulado | — | 324-ball FBGA (FG324) |
| Tipo de montaje | — | Surface Mount |
| Dynamic Power Reduction | — | Up to 40% vs ProASIC3 |
| Static Power Reduction | — | Up to 50% vs ProASIC3 |
| Max Family Performance | — | 892.86 MHz class (130 nm ProASIC3EL family) |