A3PE3000-2FG324I vs A3PE3000L-1FG324I Comparación
Comparación detallada lado a lado de A3PE3000-2FG324I por Microchip Technology y A3PE3000L-1FG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip
A3PE3000-2FG324I ✓ ActivoMicrochip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-2FG324I | A3PE3000L-1FG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $135,00 |
| Manufacturer | Microchip Technology (Microsemi) | — |
| Family | ProASIC3E | ProASIC3L Low Power Flash FPGA |
| Logic Elements (LEs) | 35000 LEs | — |
| System Gates | 3M gates | 3000000 |
| Maximum System Performance | 310 MHz | — |
| Process Technology | 130 nm flash | 130 nm CMOS flash |
| Core Supply Voltage | 1.5 V | — |
| Number of I/Os | 221 I/O | — |
| Encapsulado / Carcasa | 324-Ball FBGA | — |
| Estilo de montaje | SMD/SMT | — |
| Operating Temperature (Min) | -40 C | — |
| Operating Temperature (Max) | +85 C | — |
| Speed Grade | -2 | -1 |
| Temperature Grade | Industrial (I) | — |
| Configuration Memory | Non-volatile Flash (single chip) | Non-volatile on-chip flash (single chip, secure) |
| Packaging | Tray | — |
| Product Series | A3PE3000 | — |
| Logic Elements | — | 35K LEs (75264 D-flip-flops equivalent family density) |
| User I/O | — | 221 |
| Total RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V to 1.5 V |
| I/O Voltage | — | 1.2 V to 1.5 V (family range) |
| Low Power Feature | — | Flash*Freeze technology |
| Temperatura de funcionamiento | — | -40C to +100C (industrial, I suffix) |
| Encapsulado | — | 324-ball FBGA (FG324) |
| Tipo de montaje | — | Surface Mount |
| Dynamic Power Reduction | — | Up to 40% vs ProASIC3 |
| Static Power Reduction | — | Up to 50% vs ProASIC3 |
| Max Family Performance | — | 892.86 MHz class (130 nm ProASIC3EL family) |