A3PE3000-2PQG208 vs A3PE1500-2PQG208 Comparación
Comparación detallada lado a lado de A3PE3000-2PQG208 por Microchip Technology y A3PE1500-2PQG208 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-2PQG208 - ProASIC3E 3M-Gate Flash FPGA | Microchip
A3PE3000-2PQG208 ✓ ActivoMicrochip Technology
A3PE1500-2PQG208 - ProASIC3E FPGA, 1.5M Gates, 147 I/O | Microchip
A3PE1500-2PQG208 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-2PQG208 | A3PE1500-2PQG208 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $48,00 |
| Family | ProASIC3E (Actel/Microsemi flash FPGA) | ProASIC3E |
| System Gates | 3000000 gates | 1500000 gates |
| User I/O | 147 | 147 |
| Speed Grade | -2 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Technology | 130 nm CMOS flash | — |
| Configuration Memory | Nonvolatile on-chip flash, Instant On | Flash (single-chip, nonvolatile) |
| Encapsulado | 208-BFQFP (PQG208), 0.5 mm pitch | PQFP-208 (BFQFP-208), 28 x 28 mm |
| Terminal Form | Gull wing | — |
| Package Shape | Square | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | 0C to +70C (commercial) | 0C to +70C |
| Reprogrammability | Yes, in-system reprogrammable | — |
| Single-Chip Solution | Yes (no external configuration PROM) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Green package (lead-free) per distributor data |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Packaging | Tray | Tray |
| Logic Cells / CLBs | — | 38400 |
| Logic Elements | — | 16K |
| Embedded Memory Bits | — | 276480 bits |
| Maximum Operating Frequency | — | 350 MHz |
| Process Technology | — | 130 nm CMOS |
| Package Height | — | 3.4 mm |
| Pin Pitch | — | 0.5 mm |
| Estilo de montaje | — | SMD/SMT |