A3PE3000-FG324 vs A3PE3000-2FGG324 Comparación
Comparación detallada lado a lado de A3PE3000-FG324 por Microchip Technology y A3PE3000-2FGG324 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ ActivoMicrochip Technology
A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FGG324 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-FG324 | A3PE3000-2FGG324 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $112,30 | $216,00 |
| Family | ProASIC3E Flash Family | ProASIC3E |
| System Gates | 3,000,000 | 3000000 |
| Logic Elements / CLBs | 75,264 | — |
| Maximum System Frequency | 231 MHz | 310 MHz |
| Process Technology | 130 nm CMOS | 130 nm CMOS flash |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/Os | 221 | — |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| In-System Programming | Yes (JTAG, IEEE 1532-compliant) | — |
| Security | 128-bit AES decryption via JTAG; FlashLock | — |
| Encapsulado | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch | 324-ball FBGA (FGG324) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Embedded Memory | [DATA_NEEDED: embedded SRAM bits] | — |
| PLLs | [DATA_NEEDED: number of PLLs] | — |
| I/O Standards Supported | [DATA_NEEDED: supported I/O standards] | — |
| Estado RoHS | RoHS Non-Compliant (contains lead, per digichip listing) | Green (RoHS compliant) |
| Lead Free Status | Contains Lead (per digichip listing) | — |
| Device ESD/HBM Rating | [DATA_NEEDED: ESD rating] | — |
| Logic Cells | — | 75264 |
| CLBs | — | 75264 |
| Configuration Memory | — | Flash (single-chip, instant-on) |
| User I/O | — | 221 |
| Total Memory Bits | — | [DATA_NEEDED: embedded SRAM capacity] |
| Package Dimensions | — | 19 x 19 mm, 1 mm pitch, 1.63 mm height |
| Speed Grade | — | 2 |
| Packaging Type | — | Tray |
| Automotive Qualification | — | Not qualified (standard grade) |