A3PE3000-FG324I vs A3PE3000L-FGG324I Comparación
Comparación detallada lado a lado de A3PE3000-FG324I por Microchip Technology y A3PE3000L-FGG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-FG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324I ✓ ActivoMicrochip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-FG324I | A3PE3000L-FGG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,00 | $62,65 |
| Family | ProASIC3E | ProASIC3L (Flash FPGA) |
| Logic Elements | 35K (per distributor listing) | — |
| System Gates | 3M (3,000,000 gates) | 3,000,000 |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm flash | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | — |
| Number of I/Os | 221 | — |
| Configuration Memory | 516096 (internal flash, nonvolatile) | — |
| Encapsulado | 324-BGA (FBGA) | 324-BGA FBGA (19x19 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (SMD) |
| Temperatura de funcionamiento | -40C to +125C (industrial) | -40C to +100C (industrial) |
| Programming Type | In-System Programmable (flash, nonvolatile) | — |
| Embedded Memory | [DATA_NEEDED: embedded block RAM size] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Supported I/O Standards | [DATA_NEEDED: I/O standard list] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Total RAM Bits | — | 516096 |
| User I/O | — | 221 |
| Core Voltage | — | 1.2 V to 1.5 V |
| Technology Features | — | Nonvolatile Flash, Instant On, Flash*Freeze |
| Configuration | — | Single-chip, no external boot PROM |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Number of Package Balls | — | 324 |