A3PE3000-FGG484I vs A3PE3000-FG484 Comparación
Comparación detallada lado a lado de A3PE3000-FGG484I por Microchip Technology y A3PE3000-FG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-FGG484I - ProASIC3E FPGA 3M Gates 484-FBGA | Microchip
A3PE3000-FGG484I ✓ ActivoMicrochip Technology
A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-FGG484I | A3PE3000-FG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.451,56 | $139,75 |
| Family | ProASIC3E | ProASIC3E Flash FPGA |
| System Gates | 3000000 | 3000000 |
| Logic Cells | 75264 | — |
| User I/O | 341 | 341 |
| Embedded RAM Bits | 516096 | — |
| Core Voltage | 1.5 V | 1.5 V |
| Technology | 130 nm flash-based CMOS | — |
| Encapsulado | 484-ball FBGA (FGG484), 23 x 23 mm, 1 mm pitch | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature range] |
| Configuration Memory | Nonvolatile Flash (live at power-up) | On-chip flash (non-volatile, single-chip) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Terminal Count | 484 | — |
| Estado RoHS | [DATA_NEEDED: RoHS status of A3PE3000-FGG484I] | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) |
| REACH Compliance | Compliant (per parametric records for A3PE3000 family) | — |
| ECCN | 3A001.A.2.C | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Logic Cells (DFEs) | — | 75264 |
| System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm flash CMOS |
| Soft CPU Support | — | Optional soft ARM support |
| Differential I/O Standards | — | LVDS, LVPECL |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded block RAM capacity] |