A3PE3000L-1FG324I vs A3PE3000-2FG324I Comparación
Comparación detallada lado a lado de A3PE3000L-1FG324I por Microchip Technology y A3PE3000-2FG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ ActivoMicrochip Technology
A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip
A3PE3000-2FG324I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-1FG324I | A3PE3000-2FG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $135,00 | $0,00 |
| Family | ProASIC3L Low Power Flash FPGA | ProASIC3E |
| System Gates | 3000000 | 3M gates |
| Logic Elements | 35K LEs (75264 D-flip-flops equivalent family density) | — |
| User I/O | 221 | — |
| Total RAM Bits | 516096 | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| I/O Voltage | 1.2 V to 1.5 V (family range) | — |
| Speed Grade | -1 | -2 |
| Process Technology | 130 nm CMOS flash | 130 nm flash |
| Configuration Memory | Non-volatile on-chip flash (single chip, secure) | Non-volatile Flash (single chip) |
| Low Power Feature | Flash*Freeze technology | — |
| Temperatura de funcionamiento | -40C to +100C (industrial, I suffix) | — |
| Encapsulado | 324-ball FBGA (FG324) | — |
| Tipo de montaje | Surface Mount | — |
| Dynamic Power Reduction | Up to 40% vs ProASIC3 | — |
| Static Power Reduction | Up to 50% vs ProASIC3 | — |
| Max Family Performance | 892.86 MHz class (130 nm ProASIC3EL family) | — |
| Manufacturer | — | Microchip Technology (Microsemi) |
| Logic Elements (LEs) | — | 35000 LEs |
| Maximum System Performance | — | 310 MHz |
| Core Supply Voltage | — | 1.5 V |
| Number of I/Os | — | 221 I/O |
| Encapsulado / Carcasa | — | 324-Ball FBGA |
| Estilo de montaje | — | SMD/SMT |
| Operating Temperature (Min) | — | -40 C |
| Operating Temperature (Max) | — | +85 C |
| Temperature Grade | — | Industrial (I) |
| Packaging | — | Tray |
| Product Series | — | A3PE3000 |