A3PE3000L-1FG484I vs A3PE3000L-1FG484M Comparación
Comparación detallada lado a lado de A3PE3000L-1FG484I por Microchip Technology y A3PE3000L-1FG484M por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I ✓ ActivoMicrochip Technology
A3PE3000L-1FG484M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG484M ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-1FG484I | A3PE3000L-1FG484M |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $89,90 | $0,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3,000,000 gates | 3000000 |
| Logic Elements (LEs) | 35 KLEs | — |
| Total RAM Bits | 516096 bits | — |
| Number of I/O | 341 | 341 |
| Core Voltage | 1.2 V (family supports 1.2 V to 1.5 V) | 1.2 V to 1.5 V |
| Process Technology | 130 nm flash | — |
| Special Features | Flash*Freeze technology, non-volatile single-chip | — |
| Speed Grade | -1 | -1 (standard) |
| Encapsulado | 484-ball FBGA (FG484) | 484-ball FBGA (FG484) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Terminal Form | Ball (BGA, square) | — |
| Temperature Grade | Industrial (I) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: exact min/max operating temperature range] | — |
| Supply Voltage - I/O | [DATA_NEEDED: I/O bank voltage range] | — |
| Configuration | On-chip flash, no external boot device | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | — |
| Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Maximum Frequency | — | 250 MHz |
| Technology | — | 130 nm flash process |
| Configuration Memory | — | On-chip Flash (instant-on, reprogrammable) |
| Low Power Feature | — | Flash*Freeze technology |
| Temperature Grade / Operating Temp | — | M (per ordering code); [DATA_NEEDED: exact operating temperature range] |
| JTAG Boundary Scan | — | IEEE 1149.1 supported |
| Input Options | — | Schmitt trigger option on single-ended inputs (A3PE3000L) |
| Pull Options | — | Weak pull-up / pull-down |