A3PE3000L-1FGG484 vs A3PE3000-1FGG484 Comparación
Comparación detallada lado a lado de A3PE3000L-1FGG484 por Microchip Technology y A3PE3000-1FGG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ ActivoMicrochip Technology
A3PE3000-1FGG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG484 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-1FGG484 | A3PE3000-1FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $134,00 | $1.425,71 |
| Family | ProASIC3L | ProASIC3E |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75264 |
| User I/Os (this package) | 341 | — |
| Maximum User I/Os (family) | 616 | — |
| Embedded SRAM | Up to 504 kbits true dual-port | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Supply Voltage (I/O) | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) | — |
| Speed Grade | -1 | -1 |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| Configuration | Nonvolatile flash, Instant On, single chip | — |
| Low Power Feature | Flash*Freeze technology | — |
| Encapsulado | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch | 484-ball FBGA (FGG484) |
| Estilo de montaje | SMD/SMT | — |
| Temperatura de funcionamiento | 0C to +70C | — |
| Packaging | Tray | — |
| Power-Up Mode | Live at power-up (Level 0 support) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free per Kynix listing) |
| User I/O | — | 341 |
| Embedded Memory Bits | — | 516096 |
| Maximum System Frequency | — | 231 MHz |
| Core Supply Voltage | — | 1.5 V |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1 mm |
| Package Height | — | 2.23 mm |
| Tipo de montaje | — | Surface Mount |
| Configuration Memory | — | On-chip flash (non-volatile, single-chip) |
| Temperature Grade | — | Commercial ([DATA_NEEDED: exact operating temperature range]) |