A3PE3000L-FGG896M vs A3PE3000-2FG896I Comparación
Comparación detallada lado a lado de A3PE3000L-FGG896M por Microchip Technology y A3PE3000-2FG896I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FGG896M ✓ ActivoMicrochip Technology
A3PE3000-2FG896I - ProASIC3E FPGA 3M Gates 620 I/O | Microchip
A3PE3000-2FG896I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-FGG896M | A3PE3000-2FG896I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $195,00 |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3E Flash FPGA |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 |
| User I/Os | Up to 616 (620 per DigiKey listing) | — |
| Embedded SRAM | 504 kbits true dual-port | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| Core Voltage | 1.2 V to 1.5 V | — |
| Tensión de alimentación | 1.5 V | — |
| Encapsulado | 896-ball FBGA (FGG896), 1 mm pitch | — |
| Logic Family | CMOS | — |
| Temperatura de funcionamiento | 0 to 70 C | -40C to +85C ambient (+100C TJ) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration | Non-volatile flash, live-at-power-up Level 0, single-chip | — |
| Low-Power Feature | Flash*Freeze technology | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Input Features | Schmitt trigger option on single-ended inputs; weak pull-up/pull-down | — |
| Total RAM Bits | — | 516,096 |
| Number of I/Os | — | 620 |
| Supply Voltage (Core) | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Speed Grade | — | -2 |
| Encapsulado / Carcasa | — | 896-BGA (FBGA-896, 31 x 31 mm, 1.0 mm pitch) |
| Configuration Memory | — | On-chip flash (nonvolatile, single-chip) |
| Packaging | — | Tray |
| Estado RoHS | — | Non-compliant (lead-bearing) |
| Manufacturer Lead Time | — | 8 weeks |
| Max System Frequency | — | 350 MHz (per third-party listing) |
| Product Status | — | Active |