A3PE3000L-PQG208I vs A3PE3000-1PQG208I Comparación
Comparación detallada lado a lado de A3PE3000L-PQG208I por Microchip Technology y A3PE3000-1PQG208I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-PQG208I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-PQG208I ✓ ActivoMicrochip Technology
A3PE3000-1PQG208I - ProASIC3E FPGA 3M Gates | Microchip
A3PE3000-1PQG208I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-PQG208I | A3PE3000-1PQG208I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $48,90 | $59,90 |
| Family | ProASIC3L | ProASIC3E |
| System Gates | 3000000 | 3,000,000 |
| Total RAM Bits | 516096 | — |
| Number of I/O | 147 | — |
| Supply Voltage Range | 1.14 V to 1.575 V | — |
| Core Voltage | 1.2 V (low-power option), 1.2 V to 1.5 V range | — |
| Temperatura de funcionamiento | -40C to +100C (TJ) | -40C to +100C (I grade) |
| Encapsulado | 208-BFQFP (PQFP 28x28 mm) | 208-PQFP (BFQFP) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Technology | 130 nm flash process | — |
| Maximum Operating Frequency | 781.25 MHz | — |
| Configuration Memory | On-chip flash, single-chip (no external boot device) | — |
| Special Features | FlashFreeze technology, Power Driven Layout support | — |
| Moisture Sensitivity | MSL rated (Yes per distributor data) | — |
| Packaging | Tray, factory pack quantity 24 | — |
| Estado RoHS | Lead free (per Microchip/Mouser listing of family) | Compliant |
| Height | 3.4 mm | — |
| Length x Width | 28 mm x 28 mm | — |
| User I/Os | — | 147 |
| SRAM Bits | — | 516,096 |
| Core Supply Voltage | — | 1.5 V |
| System Performance | — | 272 MHz |
| Process Technology | — | 130-nm, 7-layer metal (6 copper) |
| Configuration | — | Flash-based, non-volatile |
| Logic Cells | — | 75,264 |
| I/O Standards | — | 3.3V, 2.5V, 1.8V |
| Live-at-Power-Up | — | Yes |