A3PE600-2FGG484 vs A3PE600-1FG484I Comparación
Comparación detallada lado a lado de A3PE600-2FGG484 por Microchip Technology y A3PE600-1FG484I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE600-2FGG484 - 600K Gate ProASIC3E FPGA 484-BGA | Microchip
A3PE600-2FGG484 ✓ ActivoMicrochip Technology
A3PE600-1FG484I - 600K-Gate Flash FPGA, 270 I/O | Microchip
A3PE600-1FG484I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE600-2FGG484 | A3PE600-1FG484I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $45,60 | $48,60 |
| Family | ProASIC3E | ProASIC3E |
| Number of Gates | 600000 | — |
| Logic Elements (LEs) | 7K LEs | — |
| User I/O | 270 | 270 |
| Configuration Bits | 110592 | — |
| Speed Grade | -2 | -1 |
| Maximum System Performance | 310 MHz | — |
| Technology | 130 nm flash CMOS | — |
| Supply Voltage (Core) | 1.425 V to 1.575 V | — |
| Configuration Memory | Non-volatile flash, single-chip | Flash-based (nonvolatile, Live-at-Power-Up Level 0) |
| Temperatura de funcionamiento | 0C to +85C (TJ) | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 484-FPBGA (23x23 mm), 1.000 mm pitch | 484-ball FBGA (PBGA484), 1.0 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Estado RoHS | RoHS3 Compliant, Lead Free | — |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| System Gates | — | 600000 |
| Logic Cells (CLBs) | — | 13824 |
| Maximum System Frequency | — | 231 MHz |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Embedded Memory (family max) | — | Up to 504 kbits True Dual-Port SRAM |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height |
| Logic Family | — | CMOS |
| Single-Chip Solution | — | Yes (no external configuration device required) |